![]() They allow more pin-out from a single package. ![]() These two are widely used in high end processor. The packages we introduced just now are most commonly used Device datasheet should include the package information You will need it for PCB layout 6 Wireless Sensor Network And Labs fall 2011ħ SMD Packages BGA: Ball Grid Array PGA: Pin Grid Array Usually refer to IC with two rows of leads QFP: Quad flat package 6 Wireless Sensor Network And Labs fall 2011Ħ SMD Packages QFN: Quad flat package, no-leads Represent size of the chip 0805 means 0.08” x 0.05” rectangle 6 Wireless Sensor Network And Labs fall 2011ĥ SMD Packages SO: Small outline QFP: Quad flat package SIP: single in-line packages DIP: dual in-line packages Through-hole package are old, their number decreased in modern design 6 Wireless Sensor Network And Labs fall 2011Ĥ SMD Packages Chip resistors, capacitors, inductors 0402, 0603, 0805, … Introduction Create schematic library Capture schematic Create PCB library (footprint) Layout 6 Wireless Sensor Network And Labs fall 2011 ![]() Wireless Sensor Network And Labs fall 2011Ģ Today’s Class Last week Create PCB library (footprint) Layout ![]()
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